Used Automatic SMT Solder Paste Inspectionis Machina 3D SPI

Exemplar KY8080
Munus temperatus resistentia
Lorem gradu Automation
Apparatus dimensio 800*1335*1627mm
Tabula Size Single Lane 50×50 – 350×330mm
Dual Lane 50×50 – 350×580mm
Fov Size 36*36mm
Virtus 220V,10A
Una venellam pondus: 600kgs
Dual lane: 650kgs
Omnis pressura 4-6 talea
Maximum loading PCB magnitudine X330 * Y350mm
Certification CE.ISO.RoHS
Transporto Package Latin sarcina lignea
Mensurae: volumen, acrarum, altitudo, XY offset, figura
Deprehensio Types Non faciendo absentis print, insufficiens stannum, superfluum stagni, bridging, offset, mal-figurarum contagione superficies
Resolutio Lens 4.5um/5um/6um/8um/10um/12um/15um/16um/18um/20um
Sagaciter: XY (Resolution) 20um
Repetitabilitas altitudo:≤1um (3 Sigma);<1%(3 Sigma)
Vadium R&R<<10%<br /> Inspection Speed ​​0.35sec/FOV-0.5sec/FOV
Mark-point Deprehensio Tempus 0.3sec/piece
Maximus Meauring Caput ± 550um (± 1200um ut optio)
Maximum mensurae altitudo PCB Warp ±5um
Minimun Pad Spacing 100um
Minimum elementum 00105/03015/008004 00105/03015/008004
Maximun Loading PCB Size (X*Y) 450x500mm(B) 470x500mm (C) 630x686mm
Apparatu repeatability accuracy<10% (5 Sigma)